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Thermaltake TG-30 Thermal Grease (Compound)
6.9OMR
Available on backorder
DELIVERY WILL BE 5-7 WORKING DAYS
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Exceptional thermal conductivity of 4.5 W/m·k
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Non-electrically conductive and designed for longevity
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“Application-friendly” kit: comes with a syringe and a honeycomb stencil to help apply a thin
- 4 g net weight – perfect for one full system application
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The TG-30 is a non-electrically conductive compound
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Longer lifespan minimizing dry-out or cracking
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التوصيل يحتاج 3–7 أيام عمل
Delivery takes 3–7 business days
Available on backorder
Description
If you’re building a high-end gaming rig, workstation, or overclocked system where every degree matters, the TG-30 gives you a premium thermal interface material (TIM) that bridges the gap between your processor and cooler more efficiently. It helps ensure your cooler can perform at its best by reducing thermal resistance.
With a reliable compound, you spend less time worrying about heat build-up or performance throttling, and more time enjoying peak performance.
Fits virtually all modern CPU and GPU coolers—air, AIO, or custom loop. Ideal for socket types such as LGA 115x, 1200, 1366, 2011, 2066 and more.
The thermal compound contains diamond powder, which would provide a thermal conductivity of 4.5 W/m-k that could fulfill the user’s primary needs.
Thermaltake’s specially formulated thermal compound fits perfectly with the honeycomb stencil, which provides an easier way to apply your thermal compound for a neat and well-covered surface that fits all CPUs.
This thermal compound application kit includes a set of easily-applied tools for immediate use.
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